About Us
Suchi Semicon Pvt Ltd is established with a vision to become a leading service provider in Outsourced Semiconductor Assembly and Testing (OSAT) or Assembly, Testing, Marking, and Packing (ATMP) industry.
Focused on providing IC-related packaging solution and test-related services.
Suchi
Group
2004
Establishment of Suchi Industries with 2 Swiss-made Embroidery Machines and Over 50 Employees.
2009
Started yarn processing and expanded to 10 machines. Also,received the first export order.
2012
Opened a marketing office in Mumbai to supply the needs of major exporters in India.
2020
Increased the portfolio by manufacturing technical textiles, eventually serving the medical industry.
2022
Started manufacturing knitted fabric, woven fabrics, and finished garments.
2023
Ventured into the semiconductor business.
SUCHI INDUSTRIES LTD.
THE PARENT COMPANY
Flagship Status : The esteemed flagship company of the Mehta Group.
Location : Headquarters in Surat, Gujarat, India. Additional units in Jolva (Near Bardoli).
Diverse Offerings : Specializes in Twisted Yarn, Embroidered Fabrics,Knitied Fabrics, and Woven Fabrics
Industry Leadership : One of India's largest Embroidery Manufacturing Units.
Dedicated Workforce : Proudly serves as a second home to approximately 700 employees.
Government Recognition : In 2022, honored by the Ministry of Textiles under the PLI Scheme for Textiles.
Founding
Members
Mr. Ashok MehtaMD - Suchi Group
• A visionary entrepreneur from Surat, he ventured into Import and Export, covering over 30 countries and establishing a global reputation.
• In 2004, he founded Suchi Industries, translating his extensive global experiences into a successful business.
• Currently, he leads a team of 700 direct and 1000 indirect employees, showcasing his profound knowledge and dedication.
• His business success is a testament to his sheer hard work and steadfast sincerity.
Mr. Shetal Mehta Director - Suchi Group
• Visionary leader and working director of the Suchi Group, Mr. Shetal Mehta, with an MSc in Marketing Strategy from War wick Business School
• Guided Suchi Industries to become India's one of the largest embroidery manufacturer,securing a position in the PLI Scheme for Textiles.
• Heads Suchi Semicon, driving initiatives for sustainable growth and global competitiveness.
• Proven track record of leadership and dedication, integral to the company's success story.
Technical Team
CEO
With over 18 years of experience in Quality and Engineering, he has held strategic leadership roles in global manufacturing firms such as Flextronics, SiTime, onsemi, Infineon Technologies, and SunPower. His commitment to "Built-In Quality" and "First Time Right" principles has translated into successful management of OSAT operations in Asia, driving Zero-Defect programs and overseeing quality initiatives globally. An adept problem solver with degrees in Electrical and Manufacturing Engineering, he serves as a Lead Auditor for ISO9001, IATF 16949:2016, and a certified auditor for VDA 6.3 Process. Before stepping into his role as CEO, our leader diligently oversaw procurement and quality operations across five major OSAT companies in Southeast Asia, ensuring excellence and efficiency in every aspect of the supply chain.
President : Technical Management
He will assume responsibility for overseeing
the whole manufacturing process. As a
distinguished process and technical
specialist, he possesses comprehensive
expertise across all equipment and
processes, adeptly employing precision
tooling.
With a career that commenced as an
equipment technician, he brings forth an
extensive hands-on experience of over 40
years. Widely recognized and sought-after,
he commands respect as an eminent
equipment and process engineer within this
industry.
Process and Equipment Specialist
He will assume the leadership role in
overseeing the intricate processes involved
in wafer handling, encompassing the
conversion of wafers into singulated die
and their subsequent attachment to a
suitable substrate, thus rendering them
primed for wire bonding.
With a wealth of experience exceeding 35
years, his proven ability to adeptly manage
the dynamic challenges inherent in these
processes stands to significantly benefit the
organisation.
Process and Equipment Specialist
Bringing over three decades of industry
expertise, he assumes leadership in the
critical process of wire bonding, essential
for rendering the die electrically active to
complete its circuitry.
This process entails the use of high-speed
automated equipment, necessitating
flexibility in handling various die bond pad
metallization and interconnecting materials
such as fine gold, copper, and aluminum
wire. Each wire type and size demands
specific setups and parameters tailored to
its material composition and dimensions,
ensuring precise execution.