Market
In 2023, the OSAT Market size was estimated at USD 43.36 billion
International OSAT Market is expected to reach $ 76.23 B by 2028
International OSAT Industry is growing at an average CAGR of 8.07%
Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029).
Indian Semiconductor Industry in 2022 was US USD 27 Billion, with over 90% being Imported
Indian semiconductor market expected to reach USD 55 billion by 2026
Indian OSAT Market expected to reach $22B in 2026
Indian OSAT Industry is expected to grow at an average CAGR of 28%
Consumer Electronics
• Integrated Circuits (ICs)
• Microprocessors and Microcontrollers
• Display Technology
• Memory Devices
• Gaming and Entertainment
Automobiles
• Engine Management Safety Systems
• Infotainment and Connectivity
• Lighting Systems
• EV Ecosystem
Smartphones
• System-on-Chip (SoC)
• Memory
• Display Technology
• Communication
• Sensors
Telecommunication
• Network Infrastructure
• Optical Communications
• Wireless Communications
• Signal Processing
• Data Storage and Transmission
IoT Devices
• Microcontrollers and System-on-Chip (SoC)
• Wireless Connectivity
• Sensors and Actuators
• Low-Power Design
• Security Features
Wearables
• Microcontrollers and SoCs
• Sensors
• Wireless Connectivity
• Display Technology
• Power Management
Devices
PDIP
Plastic DIP (PDIP) packages are usually sealed by fusing or cementing the plastic halves around the leads, but a high degree of hermeticity is not achieved because the plastic itself is usually somewhat porous to moisture and the process cannot ensure a good microscopic seal between the leads and the plastic at all points around the perimeter.
QFN
QFN is an acronym for quad flat no-lead package. It is a leadless package that comes in small size and offers moderate heat dissipation in PCBs. Like any other IC package, the function of a QFN package is to connect the silicon die of the IC to the circuit board
SC-70
SC-70 is a slow curing cutback bitumen that contains 50% bitumen, is black in color and is manufactured strictly as per ASTM D 2026M-15 standard.The SOT-23 and the SC-70 packages are two of the most widely used SOT packages today.
SOIC
The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB
SOT-223
The SOT-223-3 (TO-261AA) component package is the most common variant within the SOT-223 family. It looks similar to the SOT-23 package, but with a tab on one side instead of legs.It is commonly used for medium-power linear regulators and load switches.
SOT-23
The SOT23 package is very popular and a common package for transistors, and is also used for diodes and voltage regulators. Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. Due to their low cost and low profile, SOT’s are widely used in consumer electronics.
TO-220
The TO-220 is used for housing transistors, thyristors, and integrated circuits with low lead counts. The metal tab at the back serves as a heat sink, it has a hole so that it can be screwed onto a larger heat sink if higher power handling capability is required